Ultra Fine Polishing Powder
GRISH have three kinds of ultra fine polishing powder Silicon Carbide, Aluminum Oxide and Cerium Oxide produced by advanced grading technology. They are characterized with high purity, excellent crystal shape and uniform particle size distribution.
These are mostly used by optics, communications, display, semiconductor, data storage industry and etc.
Specifications
Abrasive | Model | Particle size |
Silicon Carbide (SC) | GC1000 | 13.5µm-16.5µm |
GC4000 | 2.5µm-3.5µm |
GC10000 | 0.3µm-0.7µm |
Aluminum Oxide (AO) | AO10000 | 0.48µm-0.55µm |
AO15000 | 0.28µm-0.35µm |
Cerium Oxide (CO) | CO2 | 1.9µm-2.3µm |
CO1.5 | 1.4µm-1.8µm |
CO1 | 0.8µm-1.2µm |
Remark: Customizations are available upon requests.
Features
1. Fine particle size and adjustable polishing effectiveness can meet various polishing requirements;
2. Centralized particle size distribution and good crystal shape can achieve precision polishing result in short time;
3. High purity can meet the request from magnetic record materials like hard disk, and semiconductor materials like silicon and other high-tech fields.
Applications
1. Semiconductor
2. Optical glass & crystal
3. Hard disk
4. LCD panel
5. Optical communication
GRISH Ultra Fine Polishing Powder.pdf