GRISH has corresponding polishing processes and consumables for compound semiconductors, including silicon carbide, aluminum nitride, gallium nitride, gallium arsenide, indium phosphide, etc., and also undertakes various types of OEM services.
GRISH has corresponding polishing processes and consumables for compound semiconductors, including silicon carbide, aluminum nitride, gallium nitride, gallium arsenide, indium phosphide, etc., and also undertakes various types of OEM services.
Specifications
Parameters | Aluminum Oxide | Inspection Method |
Particle (nm) | 200-500 | Laser Particle Analyzer |
Particle Microstructure | Spherical | SEM |
pH Value | 9-13 | pH meter |
Viscosity (cst) | ＜20 | Viscometer |
Concentration (%) | 10-30% | --- |
Features
GRISH new series of AO Polishing slurry is professionally developed for back polishing of InP & GaAs Chips. Compared to Logitech Slurry, It features high removal rate, better surface flatness (Ra, TTV, LTV), high qualification rate.
Applications
Widely used in InP Chip and GaAs Chip back polishing.
Recommend Polishing process for InP&GaAs
Logitech Polisher
First Step: Thinning, 15-30min：3-10umAluminum oxide Powder & Quartz Plate；
Second Step: Backing Polishing：30-40min：
InP: AO-1/3-20Aluminum Oxide Polishing Slurry together with PU polishing Pad
GaAs: AO-1/3-20Aluminum Oxide Polishing Slurry OrAO-1/5-10Aluminum Oxide Polishing Slurry orSO-80-PF CMP Polishing Slurry together with PU polishing Pad
