Polishing Pad

GRISH Polishing Pad has excellent micro-cellular structure which provide good polishing stability, abrasion resistance and keeping polishing liquid retention well during polishing. It is widely used for high flattening operations i.e. wafer, glass, ceramic and metal polishing etc.

Polishing Pad

GRISH Polishing Pad has excellent micro-cellular structure which provide good polishing stability, abrasion resistance and keeping polishing liquid  retention well during polishing. It is widely used for high flattening operations i.e. wafer, glass, ceramic and metal polishing etc.


Specifications


ThicknessHardnessHole depthCompression Velvt Size
percentage length
1.4±0.1mm 60±2 0.37mm 9%0.4±0.05 Φ920±2mm 
Testing instrument Vernier caliperShore durometer200X microscope200X microscopeTape measure

Remark: Customizations are available upon requests.


Features

1. Excellent micro-cellular structure, good flatness and do not epilate; 

2. High removal rate;

3. Excellent polishing stability; 

4. Scratches free and mirror effect without orange peel introduced after polishing. 


GRISH Polishing Pad.pdf



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Sapphire Wafer
Label: polishing pad
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