Semiconductor Polishing Slurry

GRISH has corresponding polishing processes and consumables for compound semiconductors, including silicon carbide, aluminum nitride, gallium nitride, gallium arsenide, indium phosphide, etc., and also undertakes various types of OEM services.

Semiconductor Polishing Slurry

GRISH has corresponding polishing processes and consumables for compound semiconductors, including silicon carbide, aluminum nitride, gallium nitride, gallium arsenide, indium phosphide, etc., and also undertakes various types of OEM services.


Specifications

Parameters

Aluminum Oxide

Inspection Method

Particle (nm)

200-500

Laser Particle Analyzer

Particle Microstructure

Spherical

SEM

pH Value

9-13

pH meter

Viscosity (cst)

<20

Viscometer

Concentration (%)

10-30%

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Features

GRISH new series of AO Polishing slurry is professionally developed for back polishing of InP & GaAs Chips.  Compared to Logitech Slurry, It features high removal rate, better surface flatness (Ra, TTV, LTV), high qualification rate.


Applications

Widely used in InP Chip and GaAs Chip back polishing.


Recommend Polishing process for InP&GaAs

Logitech Polisher

First Step: Thinning, 15-30min:3-10umAluminum oxide Powder & Quartz Plate; 

Second Step: Backing Polishing:30-40min:

InP: AO-1/3-20Aluminum Oxide Polishing Slurry together with PU polishing Pad

GaAs: AO-1/3-20Aluminum Oxide Polishing Slurry OrAO-1/5-10Aluminum Oxide Polishing Slurry orSO-80-PF CMP Polishing Slurry together with PU polishing Pad



GRISH CMP Slurry.pdf





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Polishing Machine