Ultra Fine Polishing Powder

GRISH have three kinds of ultra fine polishing powder Silicon Carbide, Aluminum Oxide and Cerium Oxide produced by advanced grading technology. They are characterized with high purity, excellent crystal shape and uniform particle size distribution. These are mostly used by optics, communications, display, semiconductor, data storage industry and etc.

Ultra Fine Polishing Powder

GRISH have three kinds of ultra fine polishing powder Silicon Carbide, Aluminum Oxide and Cerium Oxide produced by advanced grading technology. They are characterized with high purity, excellent crystal shape and uniform particle size distribution.

These are mostly used by optics, communications, display, semiconductor, data storage industry and etc.


Specifications

Abrasive

Model

Particle size

Silicon Carbide

 (SC)

GC1000

13.5µm-16.5µm

GC4000

2.5µm-3.5µm

GC10000

0.3µm-0.7µm

Aluminum Oxide

(AO)

AO10000

0.48µm-0.55µm

AO15000

0.28µm-0.35µm

Cerium Oxide

(CO)

CO2

1.9µm-2.3µm

CO1.5

1.4µm-1.8µm

CO1

0.8µm-1.2µm

Remark: Customizations are available upon requests.


Features

1. Fine particle size and adjustable polishing effectiveness can meet various polishing requirements;

2. Centralized particle size distribution and good crystal shape can achieve precision polishing result in short time;

3. High purity can meet the request from magnetic record materials like hard disk, and semiconductor materials like silicon and other high-tech fields.


Applications

1. Semiconductor

2. Optical glass & crystal

3. Hard disk

4. LCD panel

5. Optical communication


GRISH Ultra Fine Polishing Powder.pdf


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