GRISH Polishing Pad has excellent micro-cellular structure which provide good polishing stability, abrasion resistance and keeping polishing liquid retention well during polishing. It is widely used for high flattening operations i.e. wafer, glass, ceramic and metal polishing etc.
|Thickness||Hardness||Hole depth||Compression ||Velvt ||Size|
|1.4±0.1mm ||60±2 ||0.37mm ||9%||0.4±0.05 ||Φ920±2mm |
|Testing instrument ||Vernier caliper||Shore durometer||200X microscope||- ||200X microscope||Tape measure|
Remark: Customizations are available upon requests.
1. Excellent micro-cellular structure, good flatness and do not epilate;
2. High removal rate;
3. Excellent polishing stability;
4. Scratches free and mirror effect without orange peel introduced after polishing.
GRISH Polishing Pad.pdf