Talk about high power LED packaging ceramic packaging substrate

Talk about high power LED packaging ceramic packaging substrate

2021-11-10 16:08:56 3

 In the LED industry, if you increase the current intensity will make the LED luminous quantity proportionally increase, but the LED chip heat generation will also rise. Because in the high input field radiation illumination saturation and decay phenomenon, this phenomenon is mainly caused by the heat of the LED chip, so in the manufacture of high-power LED chip, must first solve the problem of heat dissipation.

The heat of white LEDs rises with the increase in input current intensity, which causes a temperature rise effect on the LED chip, resulting in lower light output, so the selection of the LED package structure and materials used is very important. In the past, LEDs often used low thermal conductivity resin package, which has become one of the reasons affecting the heat dissipation characteristics of LEDs, however, in recent years, the use of high thermal conductivity ceramics, or resin package structure with a metal plate is gradually changing. The current high power LED chips are often used to improve the luminous intensity of LED chips by increasing the size of LED chips, improving the luminous efficiency of LED chips, using high light extraction efficiency packages, and high current, etc. The conventional resin package cannot meet the demanding thermal requirements.

In the past, the traditional high heat dissipation packaging is placed on a metal substrate and then covered with resin, but the thermal expansion coefficient of the metal of this packaging method and the LED chip is quite different, when the temperature changes very large or packaging operations are not easy to produce thermal skew, which will lead to chip defects or reduced luminous efficiency. The use of ceramic packaging substrates can effectively solve the problem of thermal skew. This is mainly because the ceramic material for LED packaging is divided into alumina and aluminum nitride, the thermal conductivity of alumina is 55 times that of epoxy resin, aluminum nitride is 400 times that of epoxy resin, so most of the current high-power LED packaging substrates use aluminum with a thermal conductivity of 200W/mK, or copper metal packaging substrates with a thermal conductivity of 400W/mK.

We all know that the LED package not only protects the internal LED chip, but also has the function of connecting the LED chip to the outside for electrical connection and heat dissipation, etc. The LED package requires that the light generated by the LED chip can penetrate the outside with high efficiency, so the package must have high strength, high insulation, high thermal conductivity and high reflectivity, which makes people excited that the ceramic package has almost all the above characteristics, and then again ceramic Heat resistance and light degradation resistance is also better than resin.

  The future development of high-power LED chips, will certainly face the problem of thermal skew, which can not be ignored. High-power LED packaging structure, not only requires support for LED chip epitaxial bonding micro-wiring technology, and the development of materials, although aluminum nitride has been high thermal conductivity, but the interaction between high thermal conductivity and reflectivity has become a new problem. If the future can improve the thermal conductivity of aluminum nitride, and have close to the thermal expansion coefficient of ceramic LED chip, solve the problem of high power LED thermal skew is not a problem.


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