Typical hard polishing process - copper polishing on sapphire substrate

Typical hard polishing process - copper polishing on sapphire substrate

2021-02-25 14:24:31 21

Hard polishing generally refers to the use of hard grinding discs (Shore hardness between 80-90: such as resin copper discs, pure copper discs, etc.), with diamond polishing solution, a process for rapid polishing of sapphire substrates, window pieces, sapphire crystal polishing, optical crystals or compound semiconductor substrate materials (such as silicon carbide, gallium arsenide, etc.), etc.


A. What is the GRISH high-efficiency hard polishing process


GRISH high-efficiency hard polishing process mainly includes composite metal grinding disc and high-efficiency diamond polishing solution, as well as process parameters and usage methods developed for customers in different industries.


 Composite metal grinding discs


High efficiency diamond polishing solution


B. the application of GRISH high-efficiency hard polishing process


Typical application of high-efficiency hard polishing process - LED sapphire substrate


 Typical application of high efficiency hard polishing process - LED chip backside polishing


Other typical applications of high efficiency hard polishing processes


C. GRISH high efficiency hard polishing program features


 The combination of compound metal grinding disc and high efficiency diamond liquid can achieve super high speed rate of more than 3.0um/min for LED sapphire chips, breaking the rate limit of previous water-based diamond polishing liquid.


 The new process of composite metal lapping disc can realize the capacity increase and reduce the machine setup and floor space.


 The combination of composite metal grinding disc and high efficiency diamond solution can achieve high removal rate and reduce grinding temperature at the same time, thus reducing the consumption of grinding disc and increasing the service life of grinding disc.


D. The advantage of high-efficiency hard polishing process - high removal rate

实验速率um/min 平均速率 
高效硬抛工艺 2.62.42.52.72.52.575
现有工艺移除率 2.152222.152.15


GRISH high efficiency hard polishing process and the existing process advantage comparison-4 inch LED chip polishing

对比项目 现有工艺 高效硬抛工艺效果提升 
单次加工量 20 28 产能提高40% 
移除率 2.15um/min 2.575um/min 速率提升20% 
Ra 8-12nm 8-12nm 
钻石液消耗 10ml/ 7ml/ 钻石液节约30% 



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