Ceramic substrate capacity emergency! Price up up up, still "a piece of hard to find", the domestic alternative is imperative!(2)

Ceramic substrate capacity emergency! Price up up up, still "a piece of hard to find", the domestic alternative is imperative!(2)

2021-11-12 16:00:23 1

Direct copper plated ceramic substrate (DPC)

The production starts with pre-treatment cleaning of the ceramic substrate, depositing Ti/Cu layer on the surface of the substrate as a seed layer by vacuum sputtering, followed by photolithography, development and etching processes to complete the line production, and finally electroplating/chemical plating to increase the line thickness, and then completing the substrate production after the photoresist is removed.



In recent years, the demand for ceramic substrates has increased as the market size of semiconductor lighting and new sensors has been expanding. In particular, the DPC ceramic substrate prepared by laser punching and electroplating hole-filling technology has the advantages of high graphic accuracy and vertical packaging, which greatly improves the integration of electronic device packaging and is expected to play a greater role in the future of power device packaging. However, on the other hand, the current domestic ceramic substrate technology as a whole is backward and standards are missing, and it is urgent to strengthen the research and development of core technologies and materials to meet the rapidly developing market demand.

Reference sources.

[1] Cheng Hao, Chen Mingxiang, et al. Advances in technology and applications of ceramic substrates for power electronics packaging

[2] Hao Hongshun. Research status of ceramic substrate materials for electronic packaging

[3] Li Tingting et al. Research progress of ceramic substrate materials for electronic packaging

[4] Taiwan's ceramic substrate maker brewed price hike in the second quarter, related concepts worthy of attention. Financial sector 


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