Direct copper plated ceramic substrate (DPC)
The production starts with pre-treatment cleaning of the ceramic substrate, depositing Ti/Cu layer on the surface of the substrate as a seed layer by vacuum sputtering, followed by photolithography, development and etching processes to complete the line production, and finally electroplating/chemical plating to increase the line thickness, and then completing the substrate production after the photoresist is removed.
In recent years, the demand for ceramic substrates has increased as the market size of semiconductor lighting and new sensors has been expanding. In particular, the DPC ceramic substrate prepared by laser punching and electroplating hole-filling technology has the advantages of high graphic accuracy and vertical packaging, which greatly improves the integration of electronic device packaging and is expected to play a greater role in the future of power device packaging. However, on the other hand, the current domestic ceramic substrate technology as a whole is backward and standards are missing, and it is urgent to strengthen the research and development of core technologies and materials to meet the rapidly developing market demand.
 Cheng Hao, Chen Mingxiang, et al. Advances in technology and applications of ceramic substrates for power electronics packaging
 Hao Hongshun. Research status of ceramic substrate materials for electronic packaging
 Li Tingting et al. Research progress of ceramic substrate materials for electronic packaging
 Taiwan's ceramic substrate maker brewed price hike in the second quarter, related concepts worthy of attention. Financial sector
was established in June 2001, is a national high-tech enterprise specializing in the research and development, production and operation of ultra-precision grinding and polishing materials in China, and is a pioneer in the industry with a number of international and domestic independent intellectual property rights, many years of experience in product technology development and many customer applications.
GRISH provides customers with specialized and customized grinding and polishing solutions, as well as a variety of complementary and serialized precision grinding and polishing material products, processes and equipment, focusing on solving customers' high-end needs of ultra-precision grinding and polishing, and helping customers succeed!
Its ultra-precision polishing film & polishing tape, electrostatic flocking abrasive tape & polishing tape, 3D three-dimensional bump abrasive, single crystal & polycrystalline & polycrystalline like - diamond micro powder and corresponding abrasive solution, CMP polishing solution, abrasive additives and other ultra-precision polishing consumables developed and produced by GRISH are widely used in optical communication, automotive, semiconductor, LED, sapphire, ceramics, LCD, 3C electronics, rollers, oral medicine and other industries, and have been exported to many countries and regions such as USA, UK, Germany, Russia, Japan, Korea, India, Brazil, etc.
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