Dear members and related units:
"Thirty years of wind and rain, thirty years of spring and autumn". Since its establishment in Tianjin in 1991, the Semiconductor Materials Branch has been carrying the historical responsibility of semiconductor materials development in China, serving its members, the government and the semiconductor materials industry. Since its establishment in Tianjin in 1991, the Semiconductor Materials Branch has been carrying the historical responsibility of the development of semiconductor materials in China.
The year 2021 is a joyful year worthy of commemoration and celebration. On the occasion of the 30th anniversary of the establishment of the branch, the development of China's semiconductor materials industry has also ushered in an unprecedented development opportunity. In order to further promote the government, industry, academia, research and use of collaborative innovation, communication and cooperation, to help the rapid, healthy and orderly development of China's semiconductor materials industry, the branch is scheduled to be held in October 27-30, 2021 in Kaihua County, Zhejiang Province, "2021 China Semiconductor Materials Industry Development (Kaihua) Summit, and the 30th anniversary of the establishment of the Semiconductor Materials Branch to celebrate the General Assembly ". With the theme of "Thirty years of hard work, seize the opportunity to show the future", the conference will review the 30-year history of the association, focus on the first generation, second generation, third generation semiconductor materials and other technologies, industry status and development trends and industry hot issues to carry out active and extensive exchanges and discussions, seize the rare opportunity to strengthen and expand China's semiconductor materials industry. Semiconductor materials industry.
CMP polishing solution with wire-cut diamond micro powder and grits, B₄C suspension and suspension agent, single crystal polycrystalline class polycrystalline diamond grinding solution and micro powder, alumina polishing solution, polishing pad and other ultra-precision grinding and polishing supporting consumables with Guorisheng plane polishing machine.
Suitable for indium phosphide, gallium arsenide, silicon carbide, gallium nitride, gallium oxide and other substrate materials.
Aluminum nitride, aluminum nitride, aluminum oxide and other ceramic substrate heat dissipation materials.
Lithium tantalate, lithium niobate, zinc selenide, zinc sulfide, barium fluoride, calcium fluoride and other optical crystal materials.
It can effectively reduce the scratch rate of the processed wafer, the qualified rate of the finished product is up to 95% or more, the damage layer is <5μm, the surface finish is good, the grinding and polishing efficiency can be increased by 2-3 times, the use of consumables can be saved by 30-40% compared with the traditional process, and has obvious cost-performance advantage compared with similar products overseas!
(The above data comes from Guorisheng laboratory test data, for reference only, the actual situation varies according to the customer)
Ltd. was established in June 2001, is a national high-tech enterprise specializing in the research and development, production and operation of ultra-precision grinding and polishing materials in China, and is a pioneer in the industry with a number of international and domestic independent intellectual property rights, many years of experience in product technology development and many customer applications.
GRISH provides customers with specialized and customized grinding and polishing solutions, as well as a variety of complementary and serialized precision grinding and polishing material products, processes and equipment, focusing on solving customers' high-end needs of ultra-precision grinding and polishing, and helping customers succeed!
Its ultra-precision polishing film & polishing tape, electrostatic flocking abrasive tape & polishing tape, 3D three-dimensional bump abrasive, single crystal & polycrystalline & polycrystalline like - diamond micro powder and corresponding abrasive solution, CMP polishing solution, abrasive additives and other ultra-precision polishing consumables developed and produced by GRISH are widely used in optical communication, automotive, semiconductor, LED, sapphire, ceramics, LCD, 3C electronics, rollers, oral medicine and other industries, and have been exported to many countries and regions such as USA, UK, Germany, Russia, Japan, Korea, India, Brazil, etc.
Welcome to visit and consult us ！！！
With specialized, serialized and
matching and customized products.
Precise service to help customers succeed!
【Precision Polishing Nano Material Expert--Grish 】
【Specializing in precision grinding & polishing for 20 years】