Application of silica sol in chemical mechanical polishing (CMP) 2

Application of silica sol in chemical mechanical polishing (CMP) 2

2021-07-29 16:26:02 14

04 Nanodiamond polishing solution

Nanodiamond has the dual characteristics of diamond and nanoparticles, and the carbon surface is highly susceptible to chemical modification and compatible with any polar medium. In addition, nanodiamond has the characteristics of super hardness, large specific surface area, spherical shape and porous surface, therefore, nanodiamond can be formulated as an ideal polishing solution and widely used in the ultra-precise polishing process of hard materials.

GRISH

GRISH® monocrystalline diamond electron micrograph

GRISH

GRISH® polycrystalline diamond electron micrograph

GRISH

GRISH® rough-surface monocrystalline Diamond electron micrographs


At present, Europe, America, Japan, etc. are at the forefront in the formulation technology of nanodiamond polishing solution, while the domestic research on polishing solution has just started, and there is still a lot of room for development. However, nanodiamond is easily agglomerated and has poor dispersion stability in the medium, which is due to the large specific surface area and high surface energy of nanodiamond. Therefore, the dispersion of nanodiamond has become a common technical problem in the world.

GRISH® Monocrystalline Diamond Grinding Solution

GRISH


Product Specifications of GRISH® Monocrystalline Diamond Grinding Solution


Product Model

Particle size

water-based

oil-based

MD-6-W

MD-6-O

6µm

MD-4-W

MD-4-O

4µm

MD-3-W

MD-3-O

3µm

MD-2-W

MD-2-O

2µm

MD-1-W

MD-1-O

1µm

MD-N500-W

MD-N500-O

1/2µm

MD-N250-W

MD-N250-O

1/4µm

MD-N160-W

MD-N160-O

1/6µm

MD-N100-W

MD-N100-O

1/10µm

MD-N50-W

MD-N50-O

1/20µm

Note: In addition to the above specifications, customized products can be provided according to customer needs


GRISH® polycrystalline diamond grinding fluid

GRISH


GRISH® polycrystalline diamond grinding fluid Product Specifications


Product Model

Particle size

Water-based

oil-based

PC-6-W

PC-6-O

6µm

PC-4-W

PC-4-O

4µm

PC-3-W

PC-3-O

3µm

PC-2-W

PC-2-O

2µm

PC-1-W

PC-1-O

1µm

PC-N500-W

PC-N500-O

1/2µm

PC-N250-W

PC-N250-O

1/4µm

PC-N200-W

PC-N200-O

1/5µm

PC-N100-W

PC-N100-O

1/10µm

PC-N50-W

PC-N50-O

1/20µm

Note: In addition to the above specifications, customized products are available according to customers' needs.


GRISH® polycrystalline diamond grinding fluid Product Features

★Micro powder raw materials are self-produced to ensure the selection of high quality micro powder materials.

★Special formula, good dispersion, high removal rate and less scratches.

★Stable product grinding rate and good consistency of polished surface.


GRISH® polycrystalline diamond grinding fluid Performance Comparison


project

Major international 

brands

GRISH

Effectiveness enhancement

Single processing 

volume

20pcs/round

28pcs/round

Production capacity enhancement+40%

Removal Rate

2.15µm/min

2.575um/min

Speed increase +20%

Ra

8nm-12nm

8nm-12nm

-

Consumption

about 10ml/sheet

7ml/sheet

Diamond liquid saving-30%


GRISH® Rough-Surface Monocrystalline Diamond Grinding Solution

GRISH


GRISH® Rough-Surface Monocrystalline Diamond Grinding Solution Product Specifications


product model 

Particle size

water-based

oil-based

RC-18-W

RC-18-O

18µm

RC-10-W

RC-10-O

10µm

RC-6-W

RC-6-O

6µm

RC-5-W

RC-5-O

5µm

RC-4-W

RC-4-O

4µm

RC-3-W

RC-3-O

3µm

Note: In addition to the above specifications, customized products are available according to customers' needs.


Grish also provides monocrystalline, polycrystalline and polycrystalline diamond micropowder, please call 010-51653168 or visit our store for specific specifications.   GRISH online store at Alibaba


Conclusion


At present, the most mature application or alumina polishing solution, but cerium dioxide in the field of silicon wafer polishing also has its advantageous role, and nanodiamond polishing solution in the application of the promotion needs some development, silica sol polishing solution in today's preparation technology is more mature, no doubt will also have a broad application space.


However, in terms of the current application effect, the chemical mechanical polishing with silica sol as abrasive can basically achieve a lower surface roughness, but the material removal rate will be low compared to the harder abrasive, further improvement is needed, and the performance of a single abrasive is enhanced by compound abrasive modification has become a major trend.


According to the characteristics of the polished workpiece, through the improvement of the particle size, soft hardness and PH properties of silica sol, so that the silica sol can be oriented to a wider range of application needs, the application of silica sol in the field of chemical mechanical polishing is very promising.


Reference Sources.

1. Study on chemical mechanical polishing solution of silica sol, Xia Lin, Henan University of Technology.

2. Study on the effect of silica sol on chemical mechanical polishing of single crystal SiC, Peijie Xu, Guangdong University of Technology.

3. Study on the preparation of modified silica sol and its polishing performance on sapphire, Lei Zhang, Hefei University of Technology.

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